High Speed Semiconductor Laser Marking Machine
| Parameter | Specification |
| Laser Type | Fiber Laser Marking System with Self-developed Laser Source |
| Laser Power | 5W / 10W / 20W / 30W Optional |
| Laser Wavelength | 1064nm |
| Laser Lifetime | ≥100,000 Hours |
| Marking Speed | Up to 7000mm/s |
| Marking Accuracy | ≤0.01mm |
| Marking Area | 70×70mm / 110×110mm / 150×150mm Optional |
| Laser Source | Self-developed High Stability Fiber Laser |
| Software System | Self-developed Laser Marking Software |
| Cooling Method | Air Cooling |
| Automation | Sorting Machine / IC Handler / Production Line Integration |
| Warranty | Long Warranty Service & Technical Support |
1. Product Overview
The High Speed Semiconductor Laser Marking Machine is designed for IC packages, semiconductor devices and electronic components.
With a self-developed fiber laser source and self-developed laser marking software, this Semiconductor Laser Marking System provides high stability, long lifetime and reliable performance.
It is widely used for IC Laser Marking, QFN Laser Marking, DFN Laser Marking, SOP Package Marking, SOT Semiconductor Marking, MOSFET Laser Marking, IGBT Laser Marking, Optocoupler Laser Marking and Power Semiconductor Marking.
2. Product Advantages
• Self-developed laser source with stable output and long service life.
• Self-developed software with flexible functions and easy operation.
• High precision marking for semiconductor packages.
• High speed production up to 7000mm/s.
• Long warranty and technical support.
• Compatible with sorting machines, handlers and automated production lines.
• Permanent marking without ink or consumables.
3. Application Industries
Semiconductor Industry: IC packaging, semiconductor assembly, testing and traceability.
Package Types:
QFN Package, DFN Package, SOP Package, SOT Package, TO Package.
Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor.
Electronic Components:
Diode, Transistor, Optocoupler, Sensor Chip and electronic modules.
4. Applicable Products
IC chips, QFN, DFN, SOP, SOT, TO220, TO252, TO263, MOSFET, IGBT modules, power semiconductor devices, optocouplers, sensor chips, diodes and electronic components.
5. Sample Test Video
6. Case
