Dual Loading Automatic Semiconductor Laser Marking Machine

Parameter	Specification
Laser Type	Fiber Laser Marking System with Self-developed Laser Source
Laser Power	5W / 10W / 20W / 30W Optional
Laser Wavelength	1064nm
Laser Lifetime	≥100,000 Hours
Marking Speed	Up to 7000mm/s
Marking Accuracy	≤0.01mm
Loading System	Dual Loading Automatic Feeding System
Applicable Packages	QFN / DFN / SOP / SOT / TO / Power Devices
Software System	Self-developed Semiconductor Laser Marking Software
Laser Source	Self-developed High Stability Fiber Laser
Vision System	CCD Vision Inspection and Position Correction Optional
Automation Interface	MES / Handler / Production Line Integration
Cooling Method	Air Cooling
Warranty	Long Warranty Service and Technical Support

1. Product Overview

The Dual Loading Automatic Semiconductor Laser Marking Machine is a high efficiency inline laser marking solution designed for semiconductor packaging and electronic component manufacturers.

With dual loading automatic feeding technology, self-developed fiber laser source and self-developed marking software, this Automatic IC Laser Marking System achieves high throughput, stable operation and precise product identification.

This High Speed Semiconductor Laser Marking Equipment is widely used for IC package marking, QFN laser marking, DFN marking, SOP/SOT semiconductor marking, MOSFET marking, IGBT module marking and power semiconductor traceability applications.

2. Product Advantages

• Dual loading design: Improves production efficiency and reduces waiting time.
• Automatic feeding and unloading: Suitable for high-volume semiconductor manufacturing.
• Self-developed laser source: Long lifetime, stable output and reliable performance.
• Self-developed software: Flexible marking control and customized functions.
• High precision marking: Accuracy ≤0.01mm for semiconductor packages.
• Vision positioning: Improves marking consistency and product accuracy.
• Long warranty service: Provides reliable support for global customers.

3. Application Industries

Semiconductor Industry:
IC packaging, semiconductor assembly, testing and traceability.

Package Applications:
QFN, DFN, SOP, SOT, TO220, TO252, TO263 packages.

Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor components.

Electronic Components:
Diodes, transistors, optocouplers, sensor chips and electronic modules.

4. Applicable Products

IC chips, semiconductor packages, QFN, DFN, SOP, SOT, TO packages, MOSFET, IGBT modules, power devices, optocouplers, sensor chips and electronic components.