1. Product Overview

The Gravity Feeding Automatic Semiconductor Laser Marking Machine is a high efficiency laser marking solution designed for semiconductor packaging and electronic component manufacturers.

Using a gravity feeding automatic loading system, self-developed fiber laser source and self-developed semiconductor laser marking software, this IC Package Laser Marking System provides stable operation, high precision marking and reliable production performance.

It is widely used for Semiconductor Laser Marking, IC Laser Marking, QFN Laser Marking, DFN Laser Marking, SOP Package Marking, SOT Component Marking, MOSFET Marking, IGBT Marking and Power Semiconductor Traceability.

2. Product Advantages

• Gravity feeding structure: Stable material flow, simple design and low maintenance cost.
• Automatic loading and marking: Suitable for continuous semiconductor production.
• Self-developed laser source: Long lifetime, stable output and high reliability.
• Self-developed software: Flexible parameter control and customized functions.
• High precision marking: Accuracy ≤0.01mm for semiconductor packages.
• Automation compatibility: Supports Handler, MES and production line integration.
• Permanent marking: No ink, no consumables and environmentally friendly.

3. Application Industries

Semiconductor Industry:
IC packaging, semiconductor assembly, testing and product traceability.

Package Applications:
QFN Package, DFN Package, SOP Package, SOT Package, TO Package.

Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor components.

Electronic Components:
Diodes, transistors, optocouplers, sensor chips and electronic modules.

4. Applicable Products

IC chips, QFN, DFN, SOP, SOT, TO220, TO252, TO263, MOSFET, IGBT modules, power semiconductor devices, optocouplers, sensor chips and electronic components.

5. Sample Test Video

6. Case