Gravity Feeding Automatic Semiconductor Laser Marking Machine

Gravity Feeding Automatic Semiconductor Laser Marking Machine - Image 2

Parameter	Specification
Laser Type	Fiber Laser Marking System with Self-developed Laser Source
Laser Power	5W / 10W / 20W / 30W Optional
Laser Wavelength	1064nm
Laser Lifetime	≥100,000 Hours
Marking Speed	Up to 7000mm/s
Marking Accuracy	≤0.01mm
Feeding System	Gravity Feeding Automatic Loading System
Applicable Packages	QFN / DFN / SOP / SOT / TO / Power Device
Laser Source	Self-developed High Stability Fiber Laser
Software System	Self-developed Semiconductor Laser Marking Software
Vision System	CCD Vision Positioning Optional
Detection Function	OCR Reading / Character Inspection Optional
Automation Integration	Handler / MES / Production Line Integration
Cooling Method	Air Cooling
Warranty	Long Warranty Service & Technical Support

1. Product Overview

The Gravity Feeding Automatic Semiconductor Laser Marking Machine is a high efficiency laser marking solution designed for semiconductor packaging and electronic component manufacturers.

Using a gravity feeding automatic loading system, self-developed fiber laser source and self-developed semiconductor laser marking software, this IC Package Laser Marking System provides stable operation, high precision marking and reliable production performance.

It is widely used for Semiconductor Laser Marking, IC Laser Marking, QFN Laser Marking, DFN Laser Marking, SOP Package Marking, SOT Component Marking, MOSFET Marking, IGBT Marking and Power Semiconductor Traceability.

2. Product Advantages

• Gravity feeding structure: Stable material flow, simple design and low maintenance cost.
• Automatic loading and marking: Suitable for continuous semiconductor production.
• Self-developed laser source: Long lifetime, stable output and high reliability.
• Self-developed software: Flexible parameter control and customized functions.
• High precision marking: Accuracy ≤0.01mm for semiconductor packages.
• Automation compatibility: Supports Handler, MES and production line integration.
• Permanent marking: No ink, no consumables and environmentally friendly.

3. Application Industries

Semiconductor Industry:
IC packaging, semiconductor assembly, testing and product traceability.

Package Applications:
QFN Package, DFN Package, SOP Package, SOT Package, TO Package.

Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor components.

Electronic Components:
Diodes, transistors, optocouplers, sensor chips and electronic modules.

4. Applicable Products

IC chips, QFN, DFN, SOP, SOT, TO220, TO252, TO263, MOSFET, IGBT modules, power semiconductor devices, optocouplers, sensor chips and electronic components.