Dual Loading Automatic Semiconductor Laser Marking Machine
| Parameter | Specification |
| Laser Type | Fiber Laser Marking System with Self-developed Laser Source |
| Laser Power | 5W / 10W / 20W / 30W Optional |
| Laser Wavelength | 1064nm |
| Laser Lifetime | ≥100,000 Hours |
| Marking Speed | Up to 7000mm/s |
| Marking Accuracy | ≤0.01mm |
| Loading System | Dual Loading Automatic Feeding System |
| Applicable Packages | QFN / DFN / SOP / SOT / TO / Power Devices |
| Software System | Self-developed Semiconductor Laser Marking Software |
| Laser Source | Self-developed High Stability Fiber Laser |
| Vision System | CCD Vision Inspection and Position Correction Optional |
| Automation Interface | MES / Handler / Production Line Integration |
| Cooling Method | Air Cooling |
| Warranty | Long Warranty Service and Technical Support |
1. Product Overview
The Dual Loading Automatic Semiconductor Laser Marking Machine is a high efficiency inline laser marking solution designed for semiconductor packaging and electronic component manufacturers.
With dual loading automatic feeding technology, self-developed fiber laser source and self-developed marking software, this Automatic IC Laser Marking System achieves high throughput, stable operation and precise product identification.
This High Speed Semiconductor Laser Marking Equipment is widely used for IC package marking, QFN laser marking, DFN marking, SOP/SOT semiconductor marking, MOSFET marking, IGBT module marking and power semiconductor traceability applications.
2. Product Advantages
• Dual loading design: Improves production efficiency and reduces waiting time.
• Automatic feeding and unloading: Suitable for high-volume semiconductor manufacturing.
• Self-developed laser source: Long lifetime, stable output and reliable performance.
• Self-developed software: Flexible marking control and customized functions.
• High precision marking: Accuracy ≤0.01mm for semiconductor packages.
• Vision positioning: Improves marking consistency and product accuracy.
• Long warranty service: Provides reliable support for global customers.
3. Application Industries
Semiconductor Industry:
IC packaging, semiconductor assembly, testing and traceability.
Package Applications:
QFN, DFN, SOP, SOT, TO220, TO252, TO263 packages.
Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor components.
Electronic Components:
Diodes, transistors, optocouplers, sensor chips and electronic modules.
4. Applicable Products
IC chips, semiconductor packages, QFN, DFN, SOP, SOT, TO packages, MOSFET, IGBT modules, power devices, optocouplers, sensor chips and electronic components.
5. Sample Test Video
6. Case
