High Speed Semiconductor Laser Marking Machine


ParameterSpecification
Laser TypeFiber Laser Marking System with Self-developed Laser Source
Laser Power5W / 10W / 20W / 30W Optional
Laser Wavelength1064nm
Laser Lifetime≥100,000 Hours
Marking SpeedUp to 7000mm/s
Marking Accuracy≤0.01mm
Marking Area70×70mm / 110×110mm / 150×150mm Optional
Laser SourceSelf-developed High Stability Fiber Laser
Software SystemSelf-developed Laser Marking Software
Cooling MethodAir Cooling
AutomationSorting Machine / IC Handler / Production Line Integration
WarrantyLong Warranty Service & Technical Support


1. Product Overview

The High Speed Semiconductor Laser Marking Machine is designed for IC packages, semiconductor devices and electronic components.

With a self-developed fiber laser source and self-developed laser marking software, this Semiconductor Laser Marking System provides high stability, long lifetime and reliable performance.

It is widely used for IC Laser Marking, QFN Laser Marking, DFN Laser Marking, SOP Package Marking, SOT Semiconductor Marking, MOSFET Laser Marking, IGBT Laser Marking, Optocoupler Laser Marking and Power Semiconductor Marking.

2. Product Advantages

• Self-developed laser source with stable output and long service life.
• Self-developed software with flexible functions and easy operation.
• High precision marking for semiconductor packages.
• High speed production up to 7000mm/s.
• Long warranty and technical support.
• Compatible with sorting machines, handlers and automated production lines.
• Permanent marking without ink or consumables.

3. Application Industries

Semiconductor Industry: IC packaging, semiconductor assembly, testing and traceability.

Package Types:
QFN Package, DFN Package, SOP Package, SOT Package, TO Package.

Power Semiconductor:
MOSFET, IGBT Module, Power Device and automotive semiconductor.

Electronic Components:
Diode, Transistor, Optocoupler, Sensor Chip and electronic modules.

4. Applicable Products

IC chips, QFN, DFN, SOP, SOT, TO220, TO252, TO263, MOSFET, IGBT modules, power semiconductor devices, optocouplers, sensor chips, diodes and electronic components.

 

5. Sample Test Video

6. Case