FLS Laser officially launched a new generation of UV laser marking machine in 2026. Adopting self-developed 355nm cold laser technology and intelligent vision positioning system, the new machine achieves ultra-fine and zero-damage marking for semiconductor chips, FPC, PCB and medical plastic materials. Without fixture positioning, the equipment greatly improves production efficiency while maintaining ±0.01mm high precision. Fully compatible with automated production lines and MES system data docking, the new UV laser model has become a core solution for high-end precision manufacturing industries.